Case Study: Liquid cooling vs. Air cooling – Lidded vs. Lidless SoCs
The first-order classification is whether or not the package has a lid. In general, lidless devices are known to offer better thermal performance due to the fact they do not add additional junction-to-case thermal resistance in the form of a TIM1 inside the package and the lid itself. Lidless devices allow the thermal solution to get as close as possible to the source of the heat, which is the die. On the other hand, lidded devices might have a better thermal performance than lidless devices. The current presentation shows when it is better-lidded or lidless designs considering the bottleneck of each device design in a system approach evaluation.
&nsbp;
